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PCB常見的專業(yè)術(shù)語

2021-11-20 09:58 作者:pcb小亞  | 我要投稿

允許:permit

制造:manufacture

修改:revision

公差:tolerance

忽略:ignore(omit)

工具孔:tooling hole

安裝孔:mounting hole

元件孔:component hole

槽孔:slot

郵票孔:snap off hole

導(dǎo)通孔:via

盲孔:blind via

埋孔:buried via

金屬化孔:PTH(plating through hole)

非金屬化孔:NPTH( no plating through hole)

孔位:hole location

避免:avoid

原設(shè)計:original design

修改:modify

按原設(shè)計:leave it as it is

附邊:waste tab

銅條:copper strip

拼板強度:panel strong

板厚:board thickness

刪除:remove(delete)

削銅:shave the copper

露銅:copper exposure

光標點:fiducial mark

不同:be different from(differ from)

內(nèi)弧:inside radius

焊環(huán):annular ring

單板尺寸:single size

拼板尺寸:panel size

銑:routing

銑刀:router

V-cut:scoring

啞光:matt

光亮的:glossy

錫珠:solder ball(solder plugs)

常用PCB 專業(yè)術(shù)語

阻焊:solder mask(solder resist)

阻焊開窗:solder mask opening

單面開窗:single side mask opening

補油:touch up solder mask

補線:track welds

毛刺:burrs

去毛刺:deburr

鍍層厚度:plating thickness

清潔度:cleanliness

離子污染:ionic contamination

阻燃性:flammability retardant

黑化:black oxidation

棕化:brown oxidation

紅化:red oxidation

可焊性:solderability

焊料:solder

包裝:packaging

角標:corner mark

特性阻抗:characteristic impedance

正像:positive

負片:negative

鏡像:mirror

線寬:conductor width

線距:conductor spacing

做樣:build sample

按照:as per

成品:finished

做變更:make the chang

相類似:similar to

規(guī)格:specification

下移:shift down

垂直地:vertically

水平的:horizontally

增大:increase

縮?。篸ecrease

表面處理:Surface Finishing

波峰焊:wave solder

鉆孔數(shù)據(jù):drilling date

標記:Logo Ul

標記:Ul Marking

蝕刻標記:etched marking

周期:date code

翹曲:bow and twist

外層:outer layer

內(nèi)層:internal layer

頂層:top layer

底層:bottom layer

元件面:component side

焊接面:solder side

阻焊層:solder mask layer

絲印層:legend layer (silkscreen layer or over layer)

蘭膠層:peelable SM layer

貼片層:paste mask layer

碳油層:carbon layer

外形層:outline layer(profile layer)

白油:white ink

綠油:green ink

噴錫:hot air leveling (HAL)

水金:flash gold

插頭鍍金:plated gold edge-board contacts

金手指:Gold-finger

防氧化:Entek(OSP)

沉金:Immersion gold (chem. Gold)

沉錫:Immersion Tin(chem.Tin)

沉銀:Immersion Silver (chem. silver)

銑:CNC (mill , routing)

沖:punching

倒角:beveling

倒斜角:chamfer

倒圓角:fillet

尺寸:dimension

(深亞電子工程師小亞,整理于網(wǎng)絡(luò)


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