輸入模塊自動(dòng)對(duì)幾個(gè)

車(chē)載信號(hào)，可用于詳細(xì)的故障查找和驗(yàn)證

模塊操作特性。在每個(gè)切片內(nèi)進(jìn)行測(cè)量

HIU和FIU。

從IMB到現(xiàn)場(chǎng)連接器，輸入模塊包含大量

故障檢測(cè)和完整性測(cè)試。作為一種輸入設(shè)備，所有的測(cè)試都是

在非干擾模式下執(zhí)行。從IMB輸入的數(shù)據(jù)存儲(chǔ)在

在HIU的每個(gè)片部分上的冗余糾錯(cuò)RAM。收到

數(shù)據(jù)由每個(gè)切片投票決定。所有數(shù)據(jù)傳輸都包含一個(gè)確認(rèn)

來(lái)自接收器的響應(yīng)。

在HIU和FIU之間，有一系列光學(xué)隔離的數(shù)據(jù)鏈路

和動(dòng)力。對(duì)數(shù)據(jù)鏈路進(jìn)行同步并監(jiān)控差異。二者都

FIU和HIU都有機(jī)載溫度傳感器來(lái)表征

與溫度相關(guān)的問(wèn)題。

HIU和FIU板的電源都是冗余的，完全

儀器化和可測(cè)試。這些組件共同構(gòu)成電源完整性

子系統(tǒng)。

模塊現(xiàn)場(chǎng)輸入連接到一個(gè)稱(chēng)為∑Δ輸入的單比特ADC

環(huán)行這些電路，每個(gè)切片上每個(gè)通道一個(gè)，產(chǎn)生數(shù)字輸出

在接通和斷開(kāi)之間自然轉(zhuǎn)換。電路中的任何故障都會(huì)導(dǎo)致

輸出飽和到卡在打開(kāi)或關(guān)閉狀態(tài)，這是自動(dòng)的

檢測(cè)。由于轉(zhuǎn)換過(guò)程是動(dòng)態(tài)的，而不是像傳統(tǒng)的那樣門(mén)控

ADC，故障得到快速診斷和定位。

通過(guò)使用∑?電路，模塊中的模擬路徑短路且不會(huì)

涉及許多組件。這導(dǎo)致模擬故障包含在

單個(gè)切片上的單個(gè)通道，而不是導(dǎo)致一組八個(gè)或更多

輸入失敗。

The Input Module automatically performs local measurements of several

onboard signals that can be used for detailed fault finding and verification of

Module operating characteristics. Measurements are made within each slice’s

HIU and FIU.

From the IMB to the field connector, the Input Module contains extensive

fault detection and integrity testing. As an input device, all testing is

performed in a non-interfering mode. Data input from the IMB is stored in

redundant error-correcting RAM on each slice portion of the HIU. Received

data is voted on by each slice. All data transmissions include a confirmation

response from the receiver.

Between the HIU and FIU, there are a series of optically isolated links for data

and power. The data link is synchronized and monitored for variance. Both

the FIU and HIU have onboard temperature sensors to characterize

temperature-related problems.

The power supplies for both the HIU and FIU boards are redundant, fully

instrumented and testable. Together, these assemblies form a Power Integrity

Subsystem.

The module field input is connected to a single bit ADC known as the ΣΔ input

circuit. These circuits, one per channel on each slice, produce a digital output

that naturally transitions between on and off. Any failure in the circuit causes

the output to saturate to stuck-on or stuck-off, which is automatically

detected. As the conversion process is dynamic and not gated like traditional

ADCs, failures are rapidly diagnosed and located.

By using the Σ? circuit, the analog path in the Module is short and does not

involve many components. This results in analog failures being contained to a

single channel on a single slice instead of causing a group of eight or more

inputs to fail.