VIA Cyrix III / VIA C3

CPU ? VIA ? C3 family

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At a glance

Type:

32-bit microprocessor

Introduction:

2000

Technology (micron):

0.13 - 0.18

Frequency (MHz):

400 - 1400

L2 cache size (KB):

0, 64

Sockets:

BGA
Socket 370

VIA Cyrix III, later renamed to C3, is a family of x86-compatible microprocessors. The first generation of Cyrix III CPUs was based on a Joshua core developed by Cyrix. This core was quickly replaced by Samuel core designed by Centaur Technology. The Samuel core was manufactured using 0.18 micro technology. The core included large 64 KB level 1 code and data caches, no level 2 cache, and had much simpler design than the Joshua core. Next core - Samuel 2 - added exclusive level 2 cache to VIA Cyrix III processors. Based on 0.15 micron technology, that core had more than 40% smaller die size, and lower core voltage and power consumption than the Samuel core. With the release of Samuel2 core the VIA Cyrix III was renamed to VIA C3. The Samuel2 core was followed by Ezra core. Manufactured on 0.13 micron technology, the Ezra core had even lower power consumption than the Samuel2 processors. A variation of Ezra core, called Ezra-T, was compatible with Tualatin bus.

The last VIA C3 core was Nehemiah. This core featured full-speed integrated FPU unit, support for SSE instructions, AES encryption and random number generator. Support for 3DNow! instructions was removed from the Nehemiah processors.

List of C3 families

C3 Samuel

600 MHz (133 x 4.5, 2.0V)
370-pin ceramic PGA with heatspreader

Picture of: VIA C3-600MHz / Cyrix III-600MHz

VIA C3 Samuel microprocessor family

CPU ? VIA ? C3 ?family ? C3 Samuel

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Production microprocessors

VIA C3-400MHz / Cyrix III-400MHz

VIA C3-466MHz / Cyrix III-466MHz

466 MHz
133 MHz FSB
1.8V
370-pin ceramic PGA

VIA C3-500MHz / Cyrix III-500MHz

VIA C3-533MHz / Cyrix III-533MHz

VIA C3-550MHz / Cyrix III-550MHz

550 MHz
100 MHz FSB
370-pin ceramic PGA

VIA C3-600MHz / Cyrix III-600MHz

600 MHz (133 x 4.5, 2.0V)
370-pin ceramic PGA with heatspreader

VIA C3-650MHz / Cyrix III-650MHz

VIA C3-667MHz / Cyrix III-667MHz

VIA C3-700MHz / Cyrix III-700MHz

VIA C3-733MHz / Cyrix III-733MHz

VIA C3-750MHz / Cyrix III-750MHz

VIA C3-800MHz / Cyrix III-800MHz

VIA C3 600 MHz specifications

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General informationTypeCPU / MicroprocessorMarket segmentDesktopFamilyVIA C3 SamuelCPU part number

• C3-600MHz is an OEM/tray microprocessor

Frequency ???600 MHzBus speed ???100 MHz
133 MHzClock multiplier ???

• 6 (100 MHz FSB)

• 4.5 (133 MHz FSB)

Package370-pin ceramic PGA
1.95" x 1.95" (4.95 cm x 4.95 cm)SocketSocket 370 / PGA370Architecture / MicroarchitectureInstruction setx86Processor core ???SamuelManufacturing process0.18 micron CMOS technologyDie75mm2Data width32 bitFloating Point UnitIntegratedLevel 1 cache size ???64 KB 4-way set associative instruction cache
64 KB 4-way set associative data cachePipeline12 stagesExtensions & Technologies

• MMX instructions

• 3DNow! technology

Low power features

• Auto-HALT power down state

• Stop grant state ???

• Sleep state ???

• Deep sleep state ???

Electrical / Thermal parametersV core ???1.9V
2VMinimum/Maximum operating temperature ???0°C - 70°CTypical/Maximum power dissipation7.8 Watt / 13.1 Watt (1.9 Volt)
8.6 Watt / 14.5 Watt (2 Volt)Notes on VIA C3 600 MHz

• Recommended core voltage is indicated either on the top or on the bottom of the CPU

• Processor's FSB frequency is indicated on the top of the CPU

C3 Samuel2

750 MHz (100 x 7.5, 1.6V)
370-pin ceramic PGA

Engineering Sample
Top view

Picture of: VIA C3-750AMHz / Cyrix III-750AMHz

VIA C3 Samuel2 microprocessor family

CPU ? VIA ? C3 ?family ? C3 Samuel2

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Production microprocessors

1GigaPro C3-667AMHz EBGA

667 MHz (133 x 5, 1.6V)
368-ball enhanced BGA
Top view

VIA C3-650AMHz / Cyrix III-650AMHz

650 MHz (100 x 6.5, 1.5V)
370-pin ceramic PGA with heatspreader

VIA C3-667AMHz / Cyrix III-667AMHz

667 MHz (133 x 5, 1.5V)
370-pin ceramic PGA with heatspreader

Engineering Sample
Top view

VIA C3-667AMHz EBGA

VIA C3-700AMHz

VIA C3-733AMHz / Cyrix III-733AMHz

VIA C3-733AMHz EBGA

733 MHz (133 x 5.5, 1.6V)
368-ball enhanced BGA
Top view

VIA C3-750AMHz / Cyrix III-750AMHz

750 MHz (100 x 7.5, 1.6V)
370-pin ceramic PGA

Engineering Sample
Top view

VIA C3-750AMHz EBGA

750 MHz (100 x 7.5, 1.6V)
368-ball enhanced BGA

Engineering Sample
Top view

VIA C3-800AMHz (1.6V)

800 MHz (133 x 6, 1.6V)
370-pin ceramic PGA with heatspreader

VIA C3-800AMHz EBGA (1.65V)

800 MHz (133 x 6, 1.6V)

Comments

VIA C3 800 MHz specifications

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General informationTypeCPU / MicroprocessorMarket segmentDesktopFamilyVIA C3 Samuel2CPU part number

• C3-800AMHz (1.6V) is an OEM/tray microprocessor

Frequency ???800 MHzBus speed ???100 MHz
133 MHzClock multiplier ???

• 8 (100 MHz FSB)

• 6 (133 MHz FSB)

Package370-pin ceramic PGA
1.95" x 1.95" (4.95 cm x 4.95 cm)SocketSocket 370 / PGA370Architecture / MicroarchitectureInstruction setx86Processor core ???Samuel 2Manufacturing process0.15 micron CMOS technologyDie52mm2Data width32 bitFloating Point UnitIntegrated, running at 1/2 speedLevel 1 cache size ???64 KB 4-way set associative instruction cache
64 KB 4-way set associative data cacheLevel 2 cache size ???64 KB 4-way set associative exclusive unified (code and data) cachePipeline12 stagesExtensions & Technologies

• MMX instructions

• 3DNow! technology

Electrical / Thermal parametersV core ???1.6VMinimum/Maximum operating temperature ???0°C - 70°CTypical/Maximum power dissipation6.65 Watt / 11.3 WattNotes on VIA C3 800 MHz

• Clock multiplier is locked

C3 Ezra

933 MHz
133 MHz FSB
368-ball enhanced BGA

Picture of: VIA C3-933AMHz EBGA

VIA C3 Ezra microprocessor family

CPU ? VIA ? C3 ?family ? C3 Ezra

Related Links

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Production microprocessors

VIA C3-800AMHz (1.35V)

VIA C3-800AMHz EBGA (1.35V)

VIA C3-850AMHz

VIA C3-866AMHz

VIA C3-866AMHz EBGA

VIA C3-900AMHz

VIA C3-933AMHz

933 MHz (133 x 7, 1.35V)
370-pin ceramic PGA with heatspreader

VIA C3-933AMHz EBGA

933 MHz
133 MHz FSB

368-ball enhanced BGA

VIA C3 933 MHz specifications

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General informationTypeCPU / MicroprocessorMarket segmentDesktopFamilyVIA C3 EzraCPU part number

• C3-933AMHz is an OEM/tray microprocessor

Frequency ???933 MHzBus speed ???133 MHzClock multiplier ???7Package370-pin ceramic PGA
1.95" x 1.95" (4.95 cm x 4.95 cm)SocketSocket 370 / PGA370Architecture / MicroarchitectureInstruction setx86Processor core ???EzraManufacturing process0.13 micron CMOS technologyDie52mm2Data width32 bitFloating Point UnitIntegrated, running at 1/2 speedLevel 1 cache size ???64 KB 4-way set associative instruction cache
64 KB 4-way set associative data cacheLevel 2 cache size ???64 KB 4-way set associative exclusive unified (code and data) cachePipeline12 stagesMultiprocessingNoExtensions & Technologies

• MMX instructions

• 3DNow! technology

Low power features

• Auto-HALT power down state

• Stop grant state ???

• Sleep state ???

• Deep sleep state ???

Electrical / Thermal parametersV core ???1.35VMinimum/Maximum operating temperature ???0°C - 70°CTypical/Maximum power dissipation5.9 Watt / 10 WattNotes on VIA C3 933 MHz

• Clock multiplier is locked

C3 Nehemiah

1 GHz
133 MHz FSB
368-ball enhanced BGA

Picture of: VIA C3-1.0AGHz EBGA

VIA C3 Nehemiah microprocessor family

CPU ? VIA ? C3 ?family ? C3 Nehemiah

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Production microprocessors

VIA C3-1.0AGHz EBGA

1 GHz
133 MHz FSB
368-ball enhanced BGA

VIA C3 1 GHz specifications

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General informationTypeCPU / MicroprocessorMarket segmentDesktopFamilyVIA C3 NehemiahCPU part number

• C3-1.0AGHz EBGA is an OEM/tray microprocessor

Frequency ???1 GHz / 1000 MHzBus speed ???133 MHzClock multiplier ???7.5Package368-ball enhanced BGA
1.38" x 1.38" (3.5 cm x 3.5 cm)SocketBGA368Architecture / MicroarchitectureInstruction setx86Processor core ???NehemiahDie47mm2 (Stepping 8 or later)
52mm2 (all others)Data width32 bitFloating Point UnitIntegratedLevel 1 cache size ???64 KB 4-way set associative instruction cache
64 KB 4-way set associative data cacheLevel 2 cache size ???64 KB 16-way set associative exclusive unified cachePipeline12 stagesExtensions & Technologies

• MMX instructions

• SSE / Streaming SIMD Extensions

• Advanced Cryptography engine (CPUs with stepping 8 or later)

• Random Number Generator (CPUs with stepping 3 or later)

Electrical / Thermal parametersV core ???1.4VMinimum/Maximum operating temperature ???0°C - 85°CMaximum power dissipation ???15 WattNotes on VIA C3 1 GHz

• Stepping 8 or later processors have 2-way set associative level 1 caches

VIA C3（CPU WORLD）