The temperature environmental test chamber?is used for electrical and electronic components, automation, communication components, auto parts, metal parts, chemical materials, plastics and other industries, Arms industry, aerospace, industry, BGA, PCB substrate, electronic chip IC, semiconductor ceramics and polymer materials with physical shape changes. The test materials are pulled over and over again and the products are output high/low temperature Thermal expansion chemical or physical damage, Confirming the quality of products, from precision integrated circuits to heavy-duty mechanical components, is an important component in all areas of product testing and test cases.

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Electronic components are the foundation of high and low temperature humidity and heat test chambers, which may cause time related or stress related faults due to their inherent defects or improper control of the manufacturing process during use. In order to ensure the reliability of the entire batch of components and meet the requirements of the entire machine, it is necessary to remove components that may have malfunctioned in the early stages under operating conditions. The failure rate curve similar to "Bathtub curve" can be used to describe the process of failure rate change of parts with time. The early failure rate rapidly decreases with the increase of time, and the failure rate remains basically unchanged during its service life (or unexpected failure period).

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1. High temperature storage

The failure of electronic components is mostly caused by various physical and chemical changes in their body and surface, which are closely related to temperature. When the temperature increases, the rate of chemical reaction greatly accelerates, and the destructive process also accelerates. Enable defective components to be exposed in a timely manner for removal.

2. Power electrical aging

During the screening process, under the combined action of thermoelectric stress, various potential defects inside and on the surface of components can be well exposed, which is an important project for reliability screening.

Various electronic components are usually aged at rated power for several hours to 168 hours under normal conditions. Some products, such as integrated circuits, cannot change the conditions casually, but can use high-temperature operation to improve the working junction temperature and achieve high stress state. Various components with suitable electric pressure can be selected to be equal to or slightly higher than the rated conditions, but it cannot attract new failure mechanisms

3. Temperature cycling

Electronic products may encounter different environmental temperature conditions during use. Under the action of thermal expansion and contraction stress, components with poor thermal matching performance are prone to failure. Temperature cycling screening can effectively eliminate products with thermal performance defects by utilizing the thermal expansion and contraction stress between extreme high temperature and extreme low temperature. The commonly used screening conditions for components are -55~+125 ℃, with 5-10 cycles.

4. The necessity of component screening

The inherent reliability of electronic components depends on the reliability design of the product. During the manufacturing process of products, due to human factors or fluctuations in raw materials, process conditions, and equipment conditions, it is impossible for the final product to achieve the expected inherent reliability.

The reliability of the high and low temperature damp heat test box depends on whether the electronic components can work reliably. If early faulty components are installed on the entire equipment, the early failure rate of the entire equipment will greatly increase, and its reliability cannot meet the requirements, requiring a huge repair cost.